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電鍍級氧化銅(Copper Oxide)使用於PCB多層板的與半導體Bump電鍍製程, 在高階不溶性陽級電鍍製程中, 具有高活性與高溶解速率, 生產原料100%使用LME註冊之99.99%的電解銅板, 品質穩定…

產品規格如下:

Specification:

Cu(%)	Cl(ppm	Ni(ppm)	Fe(ppm)	Sn(ppm)	Pb(ppm)	Zn(ppm)	Na(ppm)	Ca(ppm)
≥79	≤10	≤10	≤10	≤5	≤10	≤10	≤10	≤10

Copper Oxide use for the insoluble anode plating system, higher dissolving speed and purity content, reasonable price can meet your target, contact with us!