PLATING-GRADE:電鍍級氧化銅 (Copper Oxide-Plating Grade)

Posted by:info on 2019-01-07
323
reads

電鍍級氧化銅(Copper Oxide)使用於PCB多層板的與半導體Bump電鍍製程, 在高階不溶性陽級電鍍製程中, 具有高活性與高溶解速率, 生產原料100%使用LME註冊之99.99%的電解銅板, 品質穩定…

產品規格如下:

Specification:

Cu(%)Cl(ppmNi(ppm)Fe(ppm)Sn(ppm)Pb(ppm)Zn(ppm)Na(ppm)Ca(ppm)
≥79≤10≤10≤10≤5≤10≤10≤10≤10


Copper Oxide use for the insoluble anode plating system, higher dissolving speed and purity content, reasonable price can meet your target, contact with us! 

圖片4.png

電鍍級氧化銅 (Copper Oxide-Plating Grade)